Method for manufacturing of a conductive coating structure

摘要

#CMT# #/CMT# The method involves applying an electrical conductive layer (2) on a surface of a substrate (1). A resist layer is formed in a region of the layer (2). Another region of the layer (2) is released in form of a pattern-shaped layer structure (5'''), and a third region is released. A metal layer (5) in the lateral and third regions is galvanically separated, and the resist layer is removed. The structure is formed, while the layer (2) in the former region and the metal layer on a side against the substrate are removed by etching, until the layer (2) in the former region is removed. #CMT# : #/CMT# An independent claim is also included for an electrical conductive layer structure on an electrical insulating substrate. #CMT#USE : #/CMT# Method for manufacturing a pattern-shaped electrical conductive layer structure on an electrical insulating substrate. #CMT#ADVANTAGE : #/CMT# The method allows the pattern shaped electrical conductive layer structure to be manufactured on an electrical insulating substrate in a cost effective manner, with dimensions of smaller than 20 millimeters. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a front view of an arrangement after removal of an electrical conductive layer in a region under formation of a pattern-shaped electrical conductive layer structure. 1 : Substrate 2 : Electrical conductive layer 3 : Adhesive layer 5 : Metal layer 5''' : Pattern-shaped layer structure.