MULTI-LAYERD CIRCUIT BOARD AND METHOD FOR FABRICATING THEREOF

摘要

PURPOSE: A multilayer circuit board and a manufacturing method thereof are provided to improve electrical connectivity by interconnecting wiring patterns which are formed in different layers by forming a plurality of via electrodes. CONSTITUTION: A multilayer insulating substrate(20) is composed in order to laminate a plurality of insulating layers in which a wiring pattern is formed. One or more via electrodes comprises a plurality of via units which is formed between the wring patterns in a row. The via units are crossly formed. A plurality of via electrodes(10) is formed on the multilayer insulating substrate. A plurality of via electrodes interconnects the wiring patterns which are formed in different layers. The diameter of the unit via is less than 100 micrometers.