Manufacturing method of metal plated substrate with advanced adhesive force and the substrate

摘要

PURPOSE: A manufacturing method of a metal plated substrate with advanced adhesive force and the substrate are provided to improve inter-layer coherence of a metal-plated substrate by forming a titanium layer or a titanium boron compound layer between a copper layer and a substrate. CONSTITUTION: A manufacturing method of a metal plated substrate with advanced adhesive force comprises the next step. The substrate is surface- treated in order to make surface roughness. The N2 plasma processing is proceed after the step of giving surface roughness. The titanium layer is evaporated in the top of the substrate. The copper layer is evaporated on the titanium layer. The boron is doped in the copper layer. The surface roughness as the average surface roughness value the range of 0.4 ~ 0.6μm.