| 发明名称 |
Die package including substrate with molded device |
| 摘要 |
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
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| 申请公布号 |
US8106406(B2) |
申请公布日期 |
2012.01.31 |
| 申请号 |
US20080971556 |
申请日期 |
2008.01.09 |
| 申请人 |
LIU YONG;YUAN ZHONGFA;FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
LIU YONG;YUAN ZHONGFA |
| 分类号 |
H01L27/15;H01L31/12;H01L33/00 |
主分类号 |
H01L27/15 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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