发明名称 |
Stacking package structure with chip embedded inside and die having through silicon via and method of the same |
摘要 |
The semiconductor device package structure includes a first die with a through silicon via (TSV) open from back side of the first die to expose bonding pads; a build up layer coupled between the bonding pads to terminal metal pads by the through silicon via (TSV); a substrate with a second die embedded inside and top circuit wiring and bottom circuit wiring on top and bottom side of the substrate respectively; and a conductive through hole structure coupled between the terminal metal pads to the top circuit wiring and the bottom circuit wiring.
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申请公布号 |
US8106504(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20090385358 |
申请日期 |
2009.04.06 |
申请人 |
KING DRAGON INTERNATIONAL INC. |
发明人 |
YANG WEN-KUN |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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