| 摘要 |
A semiconductor apparatus includes a first wiring substrate, a second wiring substrate, a semiconductor chip, an adhesive layer and a molding resin. The second wiring substrate is stacked and connected on the first wiring substrate through a bump electrode. The semiconductor chip is mounted on the first wiring substrate by flip chip bonding and received between the first wiring substrate and the second wiring substrate. An upper surface of the semiconductor chip is subject to a mirror treatment. The adhesive layer is formed on the upper surface of the semiconductor chip. The molding resin is filled in a gap between the first wiring substrate and the second wiring substrate.
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