发明名称 |
Methods of forming capacitors |
摘要 |
A method of forming a capacitor includes forming a conductive first capacitor electrode material comprising TiN over a substrate. TiN of the TiN-comprising material is oxidized effective to form conductive TiOxNy having resistivity no greater than 1 ohm·cm over the TiN-comprising material where x is greater than 0 and y is from 0 to 1.4. A capacitor dielectric is formed over the conductive TiOxNy. Conductive second capacitor electrode material is formed over the capacitor dielectric. Other aspects and implementations are contemplated, including capacitors independent of method of fabrication. |
申请公布号 |
US8105896(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20090480496 |
申请日期 |
2009.06.08 |
申请人 |
BHAT VISHWANATH;ROCKLEIN NOEL;GEALY F. DANIEL;MICRON TECHNOLOGY, INC. |
发明人 |
BHAT VISHWANATH;ROCKLEIN NOEL;GEALY F. DANIEL |
分类号 |
H01L21/8242 |
主分类号 |
H01L21/8242 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|