发明名称 |
Temperature uniformity measurements during rapid thermal processing |
摘要 |
Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided. |
申请公布号 |
US8104951(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20070830845 |
申请日期 |
2007.07.30 |
申请人 |
ADERHOLD WOLFGANG;HEGEDUS ANDREAS G.;MERRY NIR;APPLIED MATERIALS, INC. |
发明人 |
ADERHOLD WOLFGANG;HEGEDUS ANDREAS G.;MERRY NIR |
分类号 |
G01K3/06;G01J5/00;G01N25/00;H01L21/02 |
主分类号 |
G01K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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