| 摘要 |
PURPOSE: A multi-package module which includes an asymmetrically arranged die is provided to align laminated type complementary packages after performing solder ball reflow process with respect to a whole assembly body, thereby reducing total manufacturing costs. CONSTITUTION: A multi-package module comprises a first complementary package pair unit(80) and a second complementary package pair unit(80'). A solder ball(67') of the second complementary package pair unit is arranged with a ball pad. The ball pad is arranged in the opposite surface(11) of a die mounting surface of a substrate. The second complementary package pair unit comprises a third package and a fourth package. A third substrate comprises a land surface and a die mounting surface comprised of a die junction region and an unoccupied region.
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