发明名称 |
Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket |
摘要 |
Disclosed is a semiconductor package 3 including a socket 1 which is formed on the top surface 3a for enabling electrical conductivity and a connecting terminal 2 which is formed on the bottom surface 3b for enabling electrical conductivity. The socket 1a has a depressed shape, and a spiral contact 1 is formed in the depression 1c. An electronic circuit module is constructed by mounting and electrically connecting a semiconductor module wherein a plurality of semiconductor packages 3 is stacked on a circuit board. A circuit board with sockets is constructed by mounting a socket board on a circuit board.
|
申请公布号 |
US8106507(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20060913352 |
申请日期 |
2006.04.19 |
申请人 |
HIRAI YUKIHIRO;ADVANCED SYSTEMS JAPAN INC. |
发明人 |
HIRAI YUKIHIRO |
分类号 |
H01L23/34;H01L23/02 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|