发明名称 |
Semiconductor package and manufacturing method thereof |
摘要 |
The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.
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申请公布号 |
US8106492(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20090550645 |
申请日期 |
2009.08.31 |
申请人 |
CHANG CHIEN PAO-HUEI;HU PING-CHENG;CHIANG PO-SHING;CHENG WEI-LUN;ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHANG CHIEN PAO-HUEI;HU PING-CHENG;CHIANG PO-SHING;CHENG WEI-LUN |
分类号 |
H01L23/495;H01L23/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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