发明名称 Integrated chip carriers with thermocycler interfaces and methods of using the same
摘要 Methods and systems are provided for conducting a reaction at a selected temperature or range of temperatures over time. An array device is provided. The array device contains separate reaction chambers and is formed as an elastomeric block from multiple layers. At least one layer has at least one recess that recess has at least one deflectable membrane integral to the layer with the recess. The array device has a thermal transfer device proximal to at least one of the reaction chambers. The thermal transfer device is formed to contact a thermal control source. Reagents for carrying out a desired reaction are introduced into the array device. The array device is contacted with a thermal control device such that the thermal control device is in thermal communication with the thermal control source so that a temperature of the reaction in at least one of the reaction chamber is changed as a result of a change in temperature of the thermal control source.
申请公布号 US8105824(B2) 申请公布日期 2012.01.31
申请号 US20110987787 申请日期 2011.01.10
申请人 FACER GEOFFREY;GROSSMAN ROBERT;UNGER MARC;LAM PHILLIP;CHOU HOU-PU;KIMBALL JAKE;PIEPRZYK MARTIN;DARIDON ANTOINE;FLUIDIGM CORPORATION 发明人 FACER GEOFFREY;GROSSMAN ROBERT;UNGER MARC;LAM PHILLIP;CHOU HOU-PU;KIMBALL JAKE;PIEPRZYK MARTIN;DARIDON ANTOINE
分类号 C12M1/00;B01J19/00;B01L3/00;B01L3/06;B01L9/00;B01L99/00;C12M3/00 主分类号 C12M1/00
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