发明名称 |
Integrated circuit packaging system with a dual substrate package and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base conductive material on opposite sides of the base substrate; connecting an internal interconnect having a substantially spherical shape on the base substrate; forming a top substrate having a top conductive material on opposite sides of the top substrate with an upper component thereon facing the base substrate; and attaching the top substrate on the internal interconnect.
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申请公布号 |
US8106499(B2) |
申请公布日期 |
2012.01.31 |
申请号 |
US20090488555 |
申请日期 |
2009.06.20 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;PISIGAN JAIRUS LEGASPI;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;PISIGAN JAIRUS LEGASPI |
分类号 |
H01L23/02;H01L21/48;H01L21/50;H01L23/34;H01L23/48;H01L23/485;H01L23/498 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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