| 摘要 |
PURPOSE: A light emitting device manufacturing method is provided to prevent a fault caused by an LED after a secondary packaging process, thereby improving productivity of the light emitting device. CONSTITUTION: An LED(D) is arranged in a predetermined position of a lead frame(1). A lead frame part(L) is produced by cutting and separating the lead frame in a row of a longitudinal direction. A light emitting test is performed using a lead frame part which is cut or separated for each row. The lead frame part comprises a reflecting member which reflects light from a light emitting device. A discrete type lead frame(F2) comprises each LED which is electrically separated from each other. |
