STACKED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

PURPOSE: A laminated semiconductor package and a manufacturing method thereof are provided to improve the intensity of a semiconductor package by multiplying the thickness of a wiring board in which a plurality of semiconductor chips is laminated. CONSTITUTION: First semiconductor chips(121-124) which are laminated into a staircase type are formed on a first wiring board(100). A first substrate pad(101) is formed on one side of the first wiring board. First chip pads(131-134) are electrically connected with the first substrate pad by first bonding wires(141-144). First protective films(161-164) are formed on the upper side which is exposed of the first semiconductor chips. A first molding film(170) covers the side and the upper side of the first semiconductor chips.