| 摘要 |
PURPOSE: A semiconductor device is provided to reduce compression stress by the difference of a linear expansion coefficient of armor plating and linear expansion coefficient of a lead, thereby suppressing the growth of a whisker. CONSTITUTION: A plurality of inner leads(2a) is arranged near a semiconductor chip(4). A plurality of wires(5) respectively and electrically connects the inner lead and a surface electrode(4c) of the semiconductor chip. The semiconductor chip, inner leads, and wires are sealed by a sealing body(3). A plurality of outer leads(2b) is respectively connected to the multiple inner leads as one body. An armor plating(8) process is performed on the each surface of the multiple outer leads. |
