摘要 |
PURPOSE: An apparatus for testing the coining-power of a substrate is provided to reduce a manufacturing cost as well as improve the productivity of a substrate. CONSTITUTION: An apparatus(100a) for testing the coining-power of a substrate comprises a first head(110), a first driving part(120), and a first test jig(130). The first head coins the bump formed in the substrate and forms a first through hole. The first driving part moves the first head to place the first penetration hole when the bump is coined. The first test jig performs the power test of the substrate while being inserted into the first penetration hole when the first penetration hole is placed on the bump.
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