发明名称 APPARATUS FOR COINING-ELECTRIC INSPECTING OF SUBSTRATE
摘要 PURPOSE: An apparatus for testing the coining-power of a substrate is provided to reduce a manufacturing cost as well as improve the productivity of a substrate. CONSTITUTION: An apparatus(100a) for testing the coining-power of a substrate comprises a first head(110), a first driving part(120), and a first test jig(130). The first head coins the bump formed in the substrate and forms a first through hole. The first driving part moves the first head to place the first penetration hole when the bump is coined. The first test jig performs the power test of the substrate while being inserted into the first penetration hole when the first penetration hole is placed on the bump.
申请公布号 KR101109401(B1) 申请公布日期 2012.01.30
申请号 KR20100097028 申请日期 2010.10.05
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 HEO, KWANG MIN
分类号 G01R31/306 主分类号 G01R31/306
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