<p>OF THE DISCLOSUREA chip package mold chase, which includes a first mold chase and a second moldchase disposed oppositely to each other. The second mold chase includes a plurality ofmolding compound injecting units. The molding compound injecting units include at leasta first molding compound injecting unit and a second molding compound injecting unit,wherein the volume of the molding compound material accommodated by the first moldingcompound injecting unit is substantially equal to the volume of the molding compoundmaterial accommodated by the second molding compound injecting unit, and the quantityof the chip package structures formed by the first molding compound injecting unit is10 greater than the quantity of the chip package structures formed by the second moldingcompound injecting unit.Fig. 3</p>
