| 摘要 |
An assembly (10) comprises a housing (11) and a printed circuit board (14) received in the housing. The housing includes a housing body (12) and a cover (16). The housing body (12) has a first surface (26) supporting the printed circuit board (14) and also has a portion defining a second surface (22) receiving the cover (16). At least the portion of the housing body is formed of a material that is meltable by a laser welder. The second surface (22) is spaced from the first surface (26) by a distance that is at least as great as a thickness of the printed circuit board (14). The printed circuit board (14) is at least partially held in place by melted material from said portion. |
