发明名称 PRINTED CIRCUIT BOARD FOR TELECOMMUNICATION MODULES
摘要 <p>A board, for example a printed circuit board 10 for insertion into a telecommunication module in an insertion direction 100, the printed circuit board 10 comprising a substrate 20, having two major surfaces 92, 94, first and second conductive paths 30, arranged on a major surface of the substrate 20, for electrically contacting first and second resilient contact elements of a linearly-arranged row of resilient contact elements of the telecommunication module, wherein the first and second conductive paths 30 are arranged such that a contacting end 35 of each of the conductive paths 30 is located on a straight reference line 110 which is substantially perpendicular to the insertion direction 100, so that electrical connections between respective resilient contact elements and the respective conductive paths 30 are established at one single insertion depth. The substrate 20 is shaped such that mechanical engagement between parts 25 of the substrate 20 which are to engage mechanically with the first and second resilient contact elements, respectively, and respective resilient contact elements is completed at different insertion depths of the board into the telecommunication module.</p>
申请公布号 WO2012012360(A1) 申请公布日期 2012.01.26
申请号 WO2011US44425 申请日期 2011.07.19
申请人 3M INNOVATIVE PROPERTIES COMPANY;SZYMANSKI, GUENTER;EDELMANN, WOLFGANG;HAJOK, JOHANN G.;BUND, CHRISTINE B. 发明人 SZYMANSKI, GUENTER;EDELMANN, WOLFGANG;HAJOK, JOHANN G.;BUND, CHRISTINE B.
分类号 H05K1/11 主分类号 H05K1/11
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