发明名称 DIAGNOSIS METHOD OF ESTIMATING THERMAL FATIGUE LIFE OF SOLDER JOINT PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a diagnosis method for simply and high-precisely estimating thermal fatigue life based on numerical analysis without reliability assessment of a real machine. <P>SOLUTION: The diagnosis method comprises the steps of: forming a solder bulk specimen; obtaining fatigue life data corresponding to a plurality of strains in a strain range assumed with the specimen; obtaining crack developing speeds corresponding to respective strains from the fatigue life data; forming a thermal fatigue life curve converted into the crack length of the solder joint part using the crack developing speeds; and estimating a thermal fatigue life corresponding to the strain of the solder joint part obtained by the numerical analysis using the thermal fatigue life curve. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012018107(A) 申请公布日期 2012.01.26
申请号 JP20100156352 申请日期 2010.07.09
申请人 FUJI ELECTRIC CO LTD 发明人 KOMATSU ISAO;ASAI TATSUHIKO
分类号 G01N3/32;H05K3/34 主分类号 G01N3/32
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