| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive paste, which allows the formation of conductive film wiring even by heating at a lower temperature than that for a conventional conductive paste, and the formation of conductive film wiring lower in specific volume resistance than a conventional conductive paste, and which is excellent in adhesion and printability to a substrate. <P>SOLUTION: The conductive paste includes: a metal component; binder resin or a combination of binder resin and a hardening agent; solvent with a dispersant added thereto. The metal component consists of silver particles having an average particle diameter of 0.5 μm or larger, and silver fine particles having an average primary particle diameter of 10-200 nm. The amount of the metal component with respect to a total amount of the metal component and the binder resin (or the combination of binder resin and a hardening agent) is equal to or larger than 95 mass%. The specific volume resistance of the paste after hardening of the binder resin by heating at 200°C for 60 minutes is 10 μΩcm or smaller. <P>COPYRIGHT: (C)2012,JPO&INPIT |
