发明名称 IMPROVED ADHESION OF PROTECTIVE LAYERS OF IMAGER MICROLENS STRUCTURES
摘要 <p>Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.</p>
申请公布号 WO2012010420(A1) 申请公布日期 2012.01.26
申请号 WO2011EP61430 申请日期 2011.07.06
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION;IBM UNITED KINGDOM LIMITED;COONEY III, EDWARD, CRANDAL;MUSANTE, CHARLES, FRANCIS;LEIDY, ROBERT, KENNETH;GAMBINO, JEFFREY;TWOMBLY, JOHN 发明人 COONEY III, EDWARD, CRANDAL;MUSANTE, CHARLES, FRANCIS;LEIDY, ROBERT, KENNETH;GAMBINO, JEFFREY;TWOMBLY, JOHN
分类号 H01L27/146;C23C16/40 主分类号 H01L27/146
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