| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermally conductive resin composition which enables a molded body showing high thermal conductivity to be formed. <P>SOLUTION: The thermally conductive resin composition contains a boron nitride powder and a resin, wherein the boron nitride powder has a specific total pore volume, a specific bulk density, and an absorption intensity ratio at specific wave numbers, and is used in a specific content. A molded body is formed from the thermally conductive resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
