| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for cutting a film capable of stably cutting a film with simple operation, cutting in a stable depth, and making a plurality of incisions at a time. <P>SOLUTION: A film cutting method is characterized in cutting a film provided on a base material by relatively moving a contact point of an edge and the film while at least either of the edge and the film is energized by magnetic force. <P>COPYRIGHT: (C)2012,JPO&INPIT |
