ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component housing package which has excellent thermal conductivity and uses a heat dissipation material having a thermal expansion coefficient close to a thermal expansion coefficient of the electronic component and the like.

SOLUTION: An electronic component housing package and an electronic device comprises a heat dissipation member 1 including first metal layers 11 each having excellent thermal conductivity and second metal layers 10 each thinner than the first metal layer 11 and having thermal expansion coefficient lower than that of the first metal layer 11. The first metal layer 11 and the second metal layer 10 are alternately laminated so as to form five or more layers in which the first metal layers 11c, 11b are provided at a bottom layer and a top layer. The thickness of at least one first metal layer 11a provided at an inner layer is larger than that of the first metal layers 11c, 11b provided at the bottom layer and the top layer. The second metal layers 10 above and below the first metal layer 11a are disposed such that the rolling directions of the second metal layers 10 intersect each other.

COPYRIGHT: (C)2012,JPO&INPIT