| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide on-the-fly automatic detect classification (ADC) system and method in semiconductor processing. <P>SOLUTION: In one embodiment of the system, a source of light, for example, laser (21), illuminates a narrow region of an inspected wafer (22). Four evenly distributed dark field detectors, for example, a photomultiplier tube or CCD (26-29) are placed adjacent to the peripheral edge of the wafer so that their respective fields of view overlap to form the detection zone. Any incident light scattered in the direction of one or more of detectors (26-29) will be collected and converted into an electrical signal to be transmitted to an analyzer module (34). The analyzer module (34) detects defects on the wafer and works to classify them into different defect categories. Optionally, the system may include a dark field detector. <P>COPYRIGHT: (C)2012,JPO&INPIT |
