发明名称 SOUND ABSORBING STRUCTURE OF ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sound absorbing structure capable of improving sound absorbing effect while keeping an installation space small. <P>SOLUTION: In a sound absorbing mechanism, a plurality of sound absorbing materials 4 in prescribed forms are arranged at predetermined intervals in a cooling fluid passage from a blower 3 mounted on an electronic device 2, thereby forming a plurality of penetrating holes 5. The plurality of sound absorbing materials 4 are so arranged that sound coming from the blower 3 and vertically entering penetrating surfaces of the penetrating holes 5 does not directly go out of the electronic device 2. By attaching vibration damping materials 6, 7 and 8 to each of the sound absorbing materials 4, vibration of the sound absorbing materials 4 is suppressed, and the sound is prevented from passing through the sound absorbing materials 4 and directly going out of the electronic device 2 in the horizontal direction. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012018997(A) 申请公布日期 2012.01.26
申请号 JP20100154419 申请日期 2010.07.07
申请人 HITACHI LTD 发明人 KIMURA HIROSHI;YOKOYAMA TOMOYOSHI;INAGAKI KATSUNORI
分类号 H05K7/20;G10K11/16 主分类号 H05K7/20
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