发明名称 |
OPTICAL INTERCONNECTS IN COOLING SUBSTRATES |
摘要 |
Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components.
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申请公布号 |
US2012020020(A1) |
申请公布日期 |
2012.01.26 |
申请号 |
US20100840766 |
申请日期 |
2010.07.21 |
申请人 |
JULIEN MARTIN;BRUNNER ROBERT;TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) |
发明人 |
JULIEN MARTIN;BRUNNER ROBERT |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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