摘要 |
The invention relates to a radiation-emitting component comprising a semiconductor chip (2), which has a first main surface (25), a second main surface (26) located opposite of the first main surface, and an active region (23) provided for generating radiation; a substrate (5), on which the semiconductor chip is fastened on the side of the second main surface (26); and a decoupling layer (4), which is disposed on the first main surface (25) of the semiconductor chip (2) and forms lateral decoupling surfaces (40) spaced apart from the semiconductor chip (2) in the lateral direction, wherein a recess (45) tapering toward the semiconductor chip (2) is formed in the decoupling layer (4), said recess deflecting radiation exiting the first main surface (25) in the direction of the lateral decoupling surface (40) during operation. The invention further relates to a method for producing a radiation-emitting component. |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH;WEIDNER, KARL;RAMCHEN, JOHANN;KALTENBACHER, AXEL;WEGLEITER, WALTER;BARCHMANN, BERND;GRUBER, STEFAN;BOGNER, GEORG |
发明人 |
WEIDNER, KARL;RAMCHEN, JOHANN;KALTENBACHER, AXEL;WEGLEITER, WALTER;BARCHMANN, BERND;GRUBER, STEFAN;BOGNER, GEORG |