发明名称 |
Package-on-Package Structures with Reduced Bump Bridging |
摘要 |
A device includes a package substrate including a first non-reflowable metal bump extending over a top surface of the package substrate; a die over and bonded to the package substrate; and a package component over the die and bonded to the package substrate. The package component includes a second non-reflowable metal bump extending below a bottom surface of the package component. The package component is selected from the group consisting essentially of a device die, an additional package substrate, and combinations thereof. A solder bump bonds the first non-reflowable metal bump to the second non-reflowable metal bump. |
申请公布号 |
US2012018877(A1) |
申请公布日期 |
2012.01.26 |
申请号 |
US20100843549 |
申请日期 |
2010.07.26 |
申请人 |
YANG CHUNG-YING;SHIH CHAO-WEN;TSAI HAO-YI;CHEN HSIEN-WEI;LII MIRNG-JI;LIU TZUAN-HORNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YANG CHUNG-YING;SHIH CHAO-WEN;TSAI HAO-YI;CHEN HSIEN-WEI;LII MIRNG-JI;LIU TZUAN-HORNG |
分类号 |
H01L23/538;H01L23/488 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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