发明名称 FLOOR AND TILE SYSTEM WITH PAD
摘要 A method for installing flooring boards is provided. The method comprises laying down a two layer pad on a floor, applying a band of adhesive, laying a flooring board on the top of the two shifted-layer pad and the edge of the floor board occupying one half of the width of the band, and laying an adjacent floor board, which covers the remaining of the band of the adhesive.
申请公布号 US2012017528(A1) 申请公布日期 2012.01.26
申请号 US20100843033 申请日期 2010.07.25
申请人 LIU DAVID 发明人 LIU DAVID
分类号 E04F15/22;E04C2/20 主分类号 E04F15/22
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