| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the productivity of a semiconductor device. <P>SOLUTION: The semiconductor device comprises: a printed board 10 on which a first set of plural electrodes 11 and a second set of plural electrodes 12 are provided; a semiconductor chip 20 that is mounted on the printed board 10 and on which a first set of plural connection pads 21 forming a first line L1 along the outer periphery on the top surface and a second set of plural connection pads 22 forming a second line L2 parallel to the first line L1 and apart from the first line L1 toward the inside are provided; and a first set of bonding wires 31 and a second set of bonding wires 32 connecting the first set of electrodes 11 with the first set of connection pads 21 and connecting the second set of electrodes 12 with the second set of connection pads 22, respectively. Either one of the first set of connection pads 21 is used as a power supply voltage terminal and a system reset terminal of the semiconductor chip 20. The second set of bonding wires 32 connected to the plurality of the second set of connection pads 22 is provided above the first set of bonding wires 31 connected to the plurality of the first set of connection pads 21. <P>COPYRIGHT: (C)2012,JPO&INPIT |
