| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a package 1 which can form a plurality of through electrodes 8 and 9 over a base substrate 2 made of glass with high position accuracy. <P>SOLUTION: A plurality of through holes 13a are formed on a plate glass 30, and a plurality of through holes 13b are formed on two bases 1a and 1b. Next, the plate glass 30 is sandwiched between the two bases 1a and 1b, the through holes 13b of the bases and the through holes 13a of the plate glass 30 are aligned, and a wire made of a conductor is provided through the through holes to stretch a wire 2 between the two bases 1a and 1b. Next, the plate glass 30 is heated to a temperature higher than its softening point, the wire 2 between the bases is buried in the glass, the glass is cooled, so that a glass ingot with the wire being buried is formed. Next, there is provided a grinding process in which the ingot is sliced to make a glass substrate 11, the glass substrate 11 is polished, and the wire is exposed to the front surface and the rear surface to be a through electrode 10. <P>COPYRIGHT: (C)2012,JPO&INPIT |
