| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a camera module with reduced height and a method of manufacturing the same. <P>SOLUTION: The camera module comprises a semiconductor substrate 11 including a first main surface and a second main surface opposing the first main surface. An imaging area 12 is provided on the first main surface. A through electrode 15 is provided in a through hole which is formed between the first main surface and the second main surface and penetrates the semiconductor substrate 11. An adhesion layer 30 is provided outside the imaging area 12 on the first main surface. A lens member 20, which seals the imaging area 12 and contains an imaging lens, is directly bonded to the adhesion layer 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
