发明名称 RESIN MOLDING METHOD, DIE DEVICE, AND RESIN MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin molding method that can achieve a high grade appearance without forming welds or orientation lines as a resin flow pattern on a design surface, even in the case where a projecting die portion or the like that may split or interfere with a flow of resin exists in a cavity, and to provide a die device and resin molded article. <P>SOLUTION: Flow gates 5 capable of protruding and retracting are provided in the cavity 9 of the die 2 to control a resin filling path. The generation of welds or orientation lines as the resin flow pattern is allowed only in an area containing uneven portions outside the design surface but is not allowed in other areas. In an area where the welds or the orientation lines as the resin flow pattern occur, a separate component having the design surface is attached, thereby achieving a desired metallic appearance. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012016944(A) 申请公布日期 2012.01.26
申请号 JP20110039124 申请日期 2011.02.25
申请人 PANASONIC CORP 发明人 MATSUMURA KEIZO;MARUICHI HIROSHI
分类号 B29C45/56;B29C33/42;B29C45/73 主分类号 B29C45/56
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