| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coupling structure for a heat dissipating module, in which efficiency of thermal conduction in the overall heat dissipating module is improved and the number of components is effectively reduced to allow the reduction of manufacturing costs, by directly coupling heating members and a heat dissipating unit to each other by a heat-conductive coupling material in through holes. <P>SOLUTION: A plurality of through holes and a plurality of contacts are formed on a circuit board, and the plurality of through holes pierce the circuit board so that a first surface and a second surface of the circuit board communicate with each other. A plurality of heating members are provided on the first surface of the circuit board and are electrically connected to the contacts respectively and each has a heat-conductive part, and the heat-conductive part and each of the through holes are aligned with each other. The heat dissipating unit is coupled with the second surface of the circuit board via a coupling surface. The heat-conductive coupling material is filled in the respective through holes of the circuit board in a corresponding manner, and the heat-conductive coupling material is configured to bond the heat-conductive part of each of the heating members to a coupling surface of a main body. <P>COPYRIGHT: (C)2012,JPO&INPIT |
