发明名称 METHODS, STRUCTURES, AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF PROTECTIVE LAYERS OF IMAGER MICROLENS STRUCTURES
摘要 Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.
申请公布号 US2012018832(A1) 申请公布日期 2012.01.26
申请号 US20100841750 申请日期 2010.07.22
申请人 COONEY, III EDWARD C.;GAMBINO JEFFREY P.;LEIDY ROBERT K.;MUSANTE CHARLES F.;TWOMBLY JOHN G.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 COONEY, III EDWARD C.;GAMBINO JEFFREY P.;LEIDY ROBERT K.;MUSANTE CHARLES F.;TWOMBLY JOHN G.
分类号 H01L31/0232;G06F17/50;H01L21/30;H01L31/18 主分类号 H01L31/0232
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