发明名称 |
METHODS, STRUCTURES, AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF PROTECTIVE LAYERS OF IMAGER MICROLENS STRUCTURES |
摘要 |
Methods, structures, and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.
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申请公布号 |
US2012018832(A1) |
申请公布日期 |
2012.01.26 |
申请号 |
US20100841750 |
申请日期 |
2010.07.22 |
申请人 |
COONEY, III EDWARD C.;GAMBINO JEFFREY P.;LEIDY ROBERT K.;MUSANTE CHARLES F.;TWOMBLY JOHN G.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COONEY, III EDWARD C.;GAMBINO JEFFREY P.;LEIDY ROBERT K.;MUSANTE CHARLES F.;TWOMBLY JOHN G. |
分类号 |
H01L31/0232;G06F17/50;H01L21/30;H01L31/18 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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