发明名称 LOW LOSS PATTERN STRUCTURE OF MULTILAYER PRINTED BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a low loss pattern structure of a multilayer printed board capable of high speed transmission by using a board insulator material, by minimizing the apparent permittivity involved in signal transmission, thereby reducing dielectric loss which becomes more dominant than conductor loss in signal transmission at 5 GHz or above. <P>SOLUTION: The low loss pattern structure comprises, in a strap line for transmitting a high speed signal, a signal pattern 5, insulator layers 3, 4 formed to sandwich the signal pattern 5 from above and below, ground conductors 1, 2 attached to both surfaces of the insulator layers 3, 4, and cavities 6 formed in the insulator layers at an interval equal to or less than 1/10 of the fundamental wavelength of the high speed signal and having a diameter smaller than the width of the signal pattern 5. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012019278(A) 申请公布日期 2012.01.26
申请号 JP20100153954 申请日期 2010.07.06
申请人 NEC CORP 发明人 FUJIMOTO SHUNSUKE
分类号 H01P3/08;H05K1/02 主分类号 H01P3/08
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