发明名称 |
METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY |
摘要 |
A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module. |
申请公布号 |
US2012018838(A1) |
申请公布日期 |
2012.01.26 |
申请号 |
US201113246170 |
申请日期 |
2011.09.27 |
申请人 |
CELLURA MARK A.;NYSTROM PETER J.;PHILLIPS SCOTT J.;MEYERS JOHN P.;DINGMAN LYLE G.;DOLAN BRYAN R.;XEROX CORPORATION |
发明人 |
CELLURA MARK A.;NYSTROM PETER J.;PHILLIPS SCOTT J.;MEYERS JOHN P.;DINGMAN LYLE G.;DOLAN BRYAN R. |
分类号 |
H01L25/00 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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