| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which solves the problems that when cavities of QFP are molded by employing an individual mold method, runner parts are required for respective cavities thereby reducing the number of semiconductor devices to be obtained, and though this program can be solved by employing an MAP method, manufacturing cost increases due to use of a laminated tape whereas eject pins are required for each cavity when a through mold method is employed, so that it becomes difficult to provide a support pillar. <P>SOLUTION: In the semiconductor device manufacturing method of the present invention, a semiconductor chip is encapsulated by filling encapsulation resin in each cavity with a lead frame sandwiched between metal molds each having a matrix of cavities in which a plurality of columns of series-connected mold cavities via a through gate are arranged. At a corner portion of the matrix of cavities, a support pillar is disposed having a cross section shape, when viewed from above, to bridge all of the cavities adjacent to the corner portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
