| 摘要 |
A cooling structure of a capacitor includes a snubber capacitor in which lead terminals are joined to external electrodes of a laminated ceramic electronic component; a circuit board which is for mounting the snubber capacitor and semiconductor switching elements; and a heat dissipation plate which is made of metal that dissipates the heat generated in the circuit board. The cooling structure of the capacitor is configured such that an insulating member having a high coefficient of thermal conductivity intervenes between the snubber capacitor and the heat dissipation plate.
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