BAND-PASS FILTER MODULE AND MODULE SUBSTRATE

摘要

Provided is a band-pass filter module provided with a mounting substrate with a surface on which a BPF chip can be mounted, and a BPF chip mounted on said surface, wherein the BPF chip contains at least three-stage resonators, and the intermediate-stage resonator which is connected between the first-stage resonator closest to an input terminal and the last-stage resonator closest to an output terminal is arranged in a chip center portion. In a region of the mounting substrate overlapping the chip center portion when seen in a plan view, a ground non-arrangement portion where no ground electrode is arranged is formed over at least a range from the surface of the mounting substrate to a depth position where the topmost inner wiring layer among one or more inner wiring layers is arranged. This prevents connection between the intermediate-stage resonator and the ground electrodes included in the mounting substrate, and prevents a Q value of the intermediate-stage resonator from being lowered, thereby preventing insert loss from being increased.