ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic component module and a method of manufacturing the same.

SOLUTION: The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of one or more different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. According to the present embodiment a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided.

COPYRIGHT: (C)2012,JPO&INPIT