| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a solder plated wire capable of obtaining stably a plated wire having desired quality lowered to a 0.2% proof stress value, and improving a product yield or manufacturing efficiency. <P>SOLUTION: A softening/annealing means 51, a plating means 61 and a winding means 71 are arranged in series in this order from the upstream side along the running direction of a copper wire, and a constitution is adopted in which a copper wire having proof stress lowered by the softening/annealing means 51 is wound by the winding means 71. In the plating means 61, solder plating is applied to a copper wire surface by either thin plating setting and thick plating setting, and the thin plating setting is used as setting for applying plating to the copper wire at low traveling speed of copper wire traveling speed, and the thick plating setting is used as setting for applying plating to the copper wire at the high traveling speed of copper wire traveling speed, and such setting is adopted that plating is applied to the copper wire with a plating thickness corresponding to a soldering temperature based on a prescribed relation between the soldering temperature and the plating thickness in the high traveling speed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
