| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film formation apparatus and a film formation method which can prevent temperature rise caused by a housing frame, pipelines or the like heated due to a magnetic field generated by coils, reduce a leakage field leaking to the outside of the apparatus and reduce an installation area of the device, when performing film formation processing by induction heating. <P>SOLUTION: A film formation apparatus 100 performing film formation on a processing target substrate W by using process gases comprises a processing container 30 into which the process gases are supplied, a substrate hold section 32 provided in the processing container 30 for holding the processing target substrate W, a coil 50 for inductively heating the substrate hold section 32, a housing 70 for housing the processing container 30 and the coil 50, and a magnetic shield member 80 provided between a part 71 of the housing 70 and the coil 50 for shielding the part 71 of the housing 70 from a magnetic field generated at the coil 50. <P>COPYRIGHT: (C)2012,JPO&INPIT |
