发明名称 CARBON FILM DEPOSITION SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To provide a carbon film deposition system with high productivity, needing less decomposition cleaning of a device to be done regularly to remove by-products. <P>SOLUTION: The carbon film deposition system includes: a raw material gas introduction pipe 13 for introducing a raw material gas that contains carbon; a deposition chamber 7 for thermally decompose the raw material gas introduced from the raw material gas introduction pipe 13 to deposit a carbon film on a surface of a substrate 11; a reaction chamber 18 that is connected with the deposition chamber 7 and reacts an oxygen gas and an exhaust gas discharged from the deposition chamber 7; an oxygen gas introduction pipe 21 for introducing the oxygen gas into a reaction chamber 18; and a discharge pump 23 connected with the reaction chamber 18 to position downstream than the reaction chamber 18 in the flow direction of the exhaust gas. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012017502(A) 申请公布日期 2012.01.26
申请号 JP20100155793 申请日期 2010.07.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKABE HIROAKI;SAWADA TAKAO
分类号 C23C16/44;H01L21/205 主分类号 C23C16/44
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