METHODS OF FORMING SEMICONDUCTOR ELEMENTS USING MICRO-ABRASIVE PARTICLE STREAM

摘要

A method of fabricating a microelectronic unit 210 includes providing a semiconductor element 220 having a front 222 and rear surface 221 remote from the front surface, forming at least one opening 230 extending from the rear surface 221 through the semiconductor element 220 towards the front surface 222 by directing a jet of fine abrasive particles towards the semiconductor element, forming at least one second opening 240 extending from the first opening 230 to a bottom surface 251 of one conductive pad 250 exposed at the front surface 222, and forming at least one conductive contact 290 and at least one conductive interconnect 280a, 280b together. Each conductive interconnect 280a, 280b can extend within one or more of the first openings 230 and can be coupled to at least one conductive pad 250.