| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-reflective anisotropic conductive paste as an anisotropic conductive paste used in manufacturing a light emitting device by flip-chip mounting a light emitting element such as a light emitting diode (LED) element on a wiring board, capable of suppressing deterioration in the adhesion strength of the light emitting element to the wiring board in a high-temperature environment, and additionally, capable of suppressing deterioration in conduction reliability after TCT, when light-reflective insulting particles are blended in order to improve light emitting efficiency without equipping an LED with a light-reflective layer that would increase manufacturing cost, and also to provide a light emitting device manufactured by flip-chip mounting a light emitting element on a wiring board using the paste. <P>SOLUTION: A light-reflective anisotropic conductive paste for use in the anisotropically conductive connection of a light emitting element to a wiring board is formed by dispersing conductive particles and light-reflective insulating particles in a thermosetting resin composition, and the thermosetting resin composition contains an epoxy compound and a thermal catalyst-type hardening agent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
