| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that may be packaged without wire bonding, and methods of manufacturing the semiconductor light-emitting devices. <P>SOLUTION: The semiconductor light-emitting device includes a first electrode layer, a first insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked on a substrate, a first contact that passes through the substrate to electrically communicate with the first electrode layer, and a second contact that passes through the substrate, the first electrode layer, and the first insulating layer to electrically communicate with the second electrode layer. A contact hole that passes through the second electrode layer, the second semiconductor layer and the active layer is formed and the first electrode layer is electrically connected to the first semiconductor layer by filling the contact hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
